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IMAPS - International Microelectronics Assembly and Packaging Society

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The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society's portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 3,000 members in the United States and more than 3,000 international members around the world.
Upcoming Events:
IMAPS Power Electronics 2024
International Conference on Advanced Packaging for Power Electronics
5/8/2024 - 5/9/2024, Boston MA
IMAPS HiTEN 2024
International Conference and Exhibition on High Temperature Electronics Network
7/15/2024 - 7/17/2024, Edinburgh
IMAPS Symposium 2024 Boston
57th International Symposium on Microelectronics
9/30/2024 - 10/3/2024, Boston MA
Device Packaging 2025
21st International Conference on Device Packaging
3/3/2025 - 3/6/2025, Phoenix AZ
CICMT 2025
International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
TBD

Subsidiaries:
IMAPS Deutschland e.V.Neumarkt-St. Veit, Germany
IMAPS-UKLambourn, United Kingdom


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