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IEEE EPEPS 2018
IEEE EPEPS 2018

IEEE EPEPS 2018

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IEEE Conference on Electrical Performance of Electronic Packaging and Systems
Date: 10/21/2018 - 10/24/2018
Venue: Berkeley, San Francisco CA, United States
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society.

Website: http://www.epeps.org/
Organizer: Electrical Performance of Electronic Packaging and Systems

Previous Dates:
IEEE EPEPS 201710/15/2017 - 10/18/2017 San Francisco CA, United States
IEEE EPEPS 201610/23/2016 - 10/26/2016 San Diego CA, United States


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