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3D ASIP 2017
3D ASIP 2017

3D ASIP 2017

14th Annual Conference on 3D Architectures for Semiconductor Integration and Packaging
Date: 12/5/2017 - 12/7/2017
Venue: Marriott San San Francisco Airport, San Francisco CA, United States
The 3D ASIP conference offers a unique marketing opportunity to our sponsors. Our extensive pre-conference marketing campaign and on-site activities provide excellent exposure for your company or organization and exposure to tens of thousands of qualified industry members. Share your message during the conference with a centralized audience of senior technologists, thought leaders, and business executives in the semiconductor integration and packaging industry.

IMAPS - International Microelectronics Assembly and Packaging Society
100 Park Drive, Suite 102 (Office) Research Triangle Park, NC 27709-5127, Durham
United States
Tel: +1-919-293-5000
Previous Dates:
3D ASIP 201612/13/2016 - 12/15/2016 San Francisco CA, United States

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