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IMPACT-EMAP 2014 |
Closed
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| 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference |
| Dates:
Wednesday, October 22, 2014 - Friday, October 24, 2014
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| Venue: TWTC NANGANG Exhibition Hall,
Taipei,
Taiwan |
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| Concurrent Expo: TPCA Show 2014 - Taiwan PCB & Assembly Show | |
9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2014)
16th International Conference on Electronics Materials and Packaging (EMAP 2014)
In order to avoid dangerous climate change, provide sustainable green energy and better life for global population, the ICT products and services need to gain further effective improvements in system performance and integration, and innovate to reduce environmental impact. Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications.
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Website: http://www.impact.org.tw/
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