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IWLPC 2015 |
Closed
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Interconnecting WLP, MEMS & 3D Integration |
Dates:
Tuesday, October 13, 2015 - Thursday, October 15, 2015
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Venue: DoubleTree San Jose Airport Hotel,
San Francisco CA,
United States |
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SMTA and Chip Scale Review are pleased to announce the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
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Website: http://www.iwlpc.com/
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