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IEEE EPEPS 2019 |
Closed
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| 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems |
| Dates:
10/6/2019 - 10/9/2019
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| Venue: McGill University Campus,
Montreal,
Canada |
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EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society.
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Website: http://www.epeps.org/
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| Organizer: |
Electrical Performance of Electronic Packaging and Systems
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| Previous Dates: | | | IEEE EPEPS 2017 | 10/15/2017 - 10/18/2017 | San Francisco CA, United States | | IEEE EPEPS 2016 | 10/23/2016 - 10/26/2016 | San Diego CA, United States | |
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