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IEEE EPEPS 2019
IEEE EPEPS 2019

IEEE EPEPS 2019

Closed
28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems
Dates: 10/6/2019 - 10/9/2019
Venue: McGill University Campus, Montreal, Canada
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society.

Website: http://www.epeps.org/
Future Dates:
IEEE EPEPS 202210/9/2022 - 10/12/2022 San Jose CA, United States
IEEE EPEPS 2023 TBD, United States
Organizer: Electrical Performance of Electronic Packaging and Systems

Previous Dates:
IEEE EPEPS 201810/14/2018 - 10/17/2018 San Francisco CA, United States
IEEE EPEPS 201710/15/2017 - 10/18/2017 San Francisco CA, United States
IEEE EPEPS 201610/23/2016 - 10/26/2016 San Diego CA, United States
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