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IMPACT 2025 |
Closed
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| International Microsystems, Packaging, Assembly and Circuits Technology Conference |
| Dates:
Wednesday, October 22, 2025 - Friday, October 24, 2025
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| Venue: Taipei Nangang Exhibition Center,
Taipei,
Taiwan |
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Since its inception in 2006, the IMPACT Conference has been at the forefront of technological evolution, fostering innovation in the packaging, PCB, and semiconductor industries. Over the past two decades, IMPACT has not only witnessed but actively contributed to rapid advancements in 5G, AI, high-performance computing (HPC), edge computing, and sustainability. Each year, the conference has adapted to the latest trends, driving forward the conversation on emerging technologies and their industrial applications.
Now in its 20th year, IMPACT 2025 embraces the theme "Energy-Efficient AI: From Cloud to Edge," reflecting the industry's growing emphasis on high-performance, low-power solutions. As AI applications continue to expand - from data centers to edge devices - the need for advanced PCB, IC substrates, heterogeneous integration, and packaging technologies has become increasingly critical.
This milestone year marks not just a celebration of the past 20 years, but a bold step into the future, where IMPACT continues to lead, inspire, and drive innovation. Join us at IMPACT 2025 as we shape the next era of AI, semiconductor packaging, and PCB technology - powering a smarter, more sustainable world.
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Website: https://www.impact.org.tw/
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