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InterPACK 2018 |
Closed
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| International Technical Conference on Packaging and Intergration of Electronic and Photonic Microsystems Conference and Exhibition |
| Dates:
Monday, August 27, 2018 - Thursday, August 30, 2018
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| Venue: Hilton San Francisco Financial District,
San Francisco CA,
United States |
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InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). The international nature of the meeting has been highly beneficial in promoting global interactions between Industry and Academia. Due to the changing landscape and in order to maintain the competitive edge and leadership, going forward, InterPACK will be held annually. We are grateful for the continued co-sponsorship of The Japan Society of Mechanical Engineers (JSME) from the beginning of the InterPACK series.
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Website: https://www.asme.org/events/interpack
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