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InterPACK 2025 |
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| International Technical Conference on Packaging and Intergration of Electronic and Photonic Microsystems Conference and Exhibition |
| Dates:
TBD
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| Venue: TBD,
TBD,
United States |
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InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.
It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.
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Website: https://event.asme.org/interpack
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