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BONDexpo 2014 |
Closed
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| 8th Trade Fair for Industrial Bonding Technology |
| Dates:
Monday, October 6, 2014 - Thursday, October 9, 2014
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| Venue: Stuttgart Trade Fair Centre,
Stuttgart,
Germany |
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| Concurrent Expo: MOTEK 2014 - 33rd International Trade Fair for Assembly and Handling Technology, and Automation | |
With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.
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Website: http://www.bondexpo-messe.com/
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