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IMAPS Europe EMPC 2027 |
304 days left
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| 26th European Microelectronics and Packaging Conference (EMPC) & Exhibition |
| Dates:
2027/9/14 - 2027/9/16
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| Venue: Ingolstadt,
Ingolstadt,
Germany |
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The European Microelectronics and Packaging Conference (EMPC 2027) will take place in Ingolstadt from September 14th to 16th, 2027. In addition, short courses will be offered on the day before, September 13th.
EMPC is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS. The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.
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Website: https://imapseurope.org/event/empc-2027/
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