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Harsh Environments Conference 2024
Harsh Environments Conference 2024

Harsh Environments Conference 2024

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Electronics in Harsh Environments Conference
Dates: Tuesday, May 14, 2024 - Thursday, May 16, 2024
Venue: Technical University of Denmark, Copenhagen, Denmark
The conference focuses on building reliable electronics used in power electronics and harsh environments.

Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over powering or over heating of a device can have serious consequences including internal package failure, down-stream device errors and second level interconnect solder joint failures. Soldering residues are more problematic, and if not understood, can result in both intermittent and complete device failure.

This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Specific topics include building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards are presented.

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Surface Mount Technology Association (SMTA)
5200 Willson Road, Suite 215, Edina, MN 55424, Minneapolis
United States
Tel: +1-952-920.7682
Future Dates:
Harsh Environments Conference 2025 TBD, TBD
Previous Dates:
Harsh Environments Conference 20235/23/2023 - 5/25/2023 Amsterdam, Netherlands
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