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The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.
Its objectives are scientific, literary, and educational in character. The Society strives for the advancement of the theory and practice of electrical and electronics engineering and of the allied arts and sciences, and the maintenance of a high professional standing among its members and others and with special attention of such aims within the field of interest of the Society.
The EPS promotes close cooperation and exchange of technical information among its members and others through technical conferences and workshops, peer-reviewed publications, and collaboration with other organizations. |
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Upcoming Events: | | | | IEEE ECTC 2024 | IEEE 74th Electronic Components and Technologies Conference (ECTC) 5/28/2024 - 5/31/2024, Denver CO | | | ICEPT 2024 | 25th International Conference on Electronic Packaging Technology (ICEPT) 8/7/2024 - 8/9/2024, Tianjin | | | ESTC 2024 | 10th Electronics System-Integration Technology Conference 9/11/2024 - 9/13/2024, Berlin | | | IEEE ECTC 2025 | IEEE 75th Electronic Components and Technologies Conference (ECTC) 5/26/2025 - 5/31/2025, Dallas TX | | | IEEE ECTC 2026 | IEEE 76th Electronic Components and Technologies Conference (ECTC) 5/25/2026 - 5/30/2026, San Diego CA |
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