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IEEE Electronics Packaging Society

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The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.

Its objectives are scientific, literary, and educational in character. The Society strives for the advancement of the theory and practice of electrical and electronics engineering and of the allied arts and sciences, and the maintenance of a high professional standing among its members and others and with special attention of such aims within the field of interest of the Society.

The EPS promotes close cooperation and exchange of technical information among its members and others through technical conferences and workshops, peer-reviewed publications, and collaboration with other organizations.
Upcoming Events:
IEEE ECTC 2025
IEEE 75th Electronic Components and Technologies Conference (ECTC)
5/27/2025 - 5/30/2025, Grapevine TX
ICEPT 2025
26th International Conference on Electronic Packaging Technology (ICEPT)
8/5/2025 - 8/7/2025, Shanghai
EPTC 2025
27th Electronics Packaging Technology Conference
12/5/2025 - 12/7/2025, Singapore
IEEE ECTC 2026
IEEE 76th Electronic Components and Technologies Conference (ECTC)
5/25/2026 - 5/30/2026, San Diego CA
ICEPT 2026
27th International Conference on Electronic Packaging Technology (ICEPT)
TBD

Headquarters:
IEEE - Institute of Electrical and Electronics Engineers, Inc.New York, United States


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