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The Japan Institute of Electronics packaging (JIEP) was established in 1998 by the merger of the former ¡ºSociety for Hybrid Microelectronics¡± and the former ¡ºJapan Institute for Printed Circuit,¡± and is one of the largest academic societies for electronics packaging technology in Japan. Some 2,400 researchers and engineers, active in the front lines of industry and academia, form a community concerned with packaging technology, one of the core technologies of Japan's electronics industry, and contribute to the advancement of research and development and the training of engineers. |
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| Upcoming Events: | |  | | ICEP-HBS 2026 | International Conference on Electronic Packaging & Hybrid Bonding Symposium 4/14/2026 - 4/18/2026, Hiroshima |  | | ICEP 2027 | International Conference on Electronic Packaging TBD |
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