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Device Packaging 2015 |
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| 11th International Conference on Device Packaging |
| Dates:
Monday, March 16, 2015 - Thursday, March 19, 2015
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| Venue: Radisson Fort McDowell Resort and Casino,
Phoenix AZ,
United States |
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The 11th Annual Device Packaging Conference (DPC 2015) will be held in Fountain Hills, Arizona, on March 16-19, 2015. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
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Website: http://www.imaps.org/devicepackaging
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