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IMAPS - International Microelectronics Assembly and Packaging Society

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The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society's portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 3,000 members in the United States and more than 3,000 international members around the world.
Upcoming Events:
IMAPS Device Packaging 2027
23rd International Conference on Device Packaging
3/1/2027 - 3/4/2027, Phoenix AZ
CHIPcon 2027
The Leading Event for Chiplet and Heterogeneous Integration Packaging (CHIP) Technology
TBD
IMAPS Symposium 2027
60th International Symposium on Microelectronics
TBD
IMAPS Device Packaging 2028
24th International Conference on Device Packaging
Phoenix AZ
Electronics for Extreme Environments 2028
IMAPS Electronics for Extreme Environments Conference
TBD

Subsidiaries:
IMAPS-Europe e.V.Neumarkt-St. Veit, Germany
IMAPS-UKLambourn, United Kingdom


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