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IMAPS - International Microelectronics Assembly and Packaging Society

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The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society's portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 3,000 members in the United States and more than 3,000 international members around the world.
Upcoming Events:
IMAPS Symposium 2026
59th International Symposium on Microelectronics
9/28/2026 - 10/1/2026, Boston MA
Si Photonics Packaging Summit 2026
Si Photonics Packaging Summit
10/1/2026 - 10/2/2026, Boston MA
IMAPS Device Packaging 2027
23rd International Conference on Device Packaging
3/1/2027 - 3/4/2027, Phoenix AZ
CHIPcon 2027
The Leading Event for Chiplet and Heterogeneous Integration Packaging (CHIP) Technology
TBD
IMAPS Symposium 2027
60th International Symposium on Microelectronics
TBD

Subsidiaries:
IMAPS-Europe e.V.Neumarkt-St. Veit, Germany
IMAPS-UKLambourn, United Kingdom


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