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| Symposium on Polymers 2016 |
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Symposium on Polymers 2016 |
Closed
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| 17th Symposium on Polymers for Microelectronics |
| Dates:
Monday, April 25, 2016 - Wednesday, April 27, 2016
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| Venue: Winterthur Museum,
Wilmington DE,
United States |
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The International Microelectronics Assembly and Packaging Society (IMAPS) is organizing the 17th Symposium on Polymers for Microelectronics. The theme for the 17th Symposium on Polymers for microelectronics is Innovations Driving a Smart and Interconnected World and will continue the event's focus on polymeric materials for microelectronic applications including traditional and new application areas.
Traditional areas covered include stress buffer materials that have evolved from PSB to RDL to fan out packaging applications for multilayer interconnect for 2D/3D packaging. Other materials to be discussed include substrates, including flex films and encapsulate materials as well as other polymeric materials used in electronics packaging. Applications spaces include wafer/IC packaging (including WSS adhesives and patterning), additive manufacturing, medical/IoT devices/packages as well as fundamental material and characterization and properties of new/critical materials and new processes that enhance performance and lower cost will also be covered.
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Website: http://www.imaps.org/polymers/
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