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ICEPT 2025 |
Closed
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| 26th International Conference on Electronic Packaging Technology (ICEPT) |
| Dates:
Tuesday, August 5, 2025 - Thursday, August 7, 2025
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| Venue: Sheraton Shanghai Jiading,
Shanghai,
China |
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The International Conference on Electronic Packaging Technology (ICEPT) is the largest and most cohesive packaging technology conference in Asia, which is hosted by Shanghai University, IEEE Electronics Packaging Society (IEEE-EPS), and Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics (CIE-EMPT).
Organized by National Center for Advanced Packaging (NCAP) , and BeiJing HengRenZhiXin Consulting Company, China. ICEPT held in China every year, conference topics including Packaging Design, Manufacturing Technologies, R&D, and Photonics, MEMS, System Integrated Packaging etc..., since it inaugurated in 1994, ICEPT has been held by Tsinghua University, Peking University, Fudan University, Harbin Institute of technology, Huazhong University of science and technology, Shanghai Jiaotong University, Xi'an University of Electronic Science and technology, Shanghai University, Guilin University of Electronic Science and technology, Dalian University of technology, University of Electronic Science and technology, Central South University, Hong Kong University of science and technology, Guangdong University of technology, Tiangong University and other universities for 25 sessions, and supported by relevant government units at all levels.
ICEPT attracts a large number of domestic and foreign universities, research institutions, electronic packaging manufacturers participate, more than 800 Well known experts, scholars and business people from about 20 countries and regions.
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Website: http://www.icept.org/
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| Previous Dates: | | | ICEPT 2024 | 8/7/2024 - 8/9/2024 | Tianjin, China | | ICEPT 2023 | 8/8/2023 - 8/11/2023 | Shihezi City, China | |
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