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ICEP 2024 ICEP 2024 Closed International Conference on Electronic Packaging Dates: Wednesday, April 17, 2024 - Saturday, April 20, 2024 Venue: Toyama International Conference Center, Toyama, Japan ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. Website: https://www.jiep.or.jp/icep/ Venues Toyama International Conference Center 1-2 Ote-machi Toyama-city Toyama 930-0084, Toyama Japan Tel: +81-76-424 5931 https://www.ticc.co.jp/ Organizers Japan Institute of Electronics packaging (JIEP) 3-12-2 Nishiogikita, Suginami-ku, Tokyo 167-0042, Tokyo Japan Tel: +81-03-5310-2010 https://www.jiep.or.jp/ Future Dates: ICEP 2025 4/15/2025 - 4/19/2025 Nagano, Japan ICEP-HBS 2026 4/14/2026 - 4/18/2026 Hiroshima, Japan ICEP 2027 TBD, Japan Previous Dates: Related Events: IEEE MWSCAS 2026 8/9/2026 - 8/12/2026 Cincinnatti OH, United States EeIE 2026 8/26/2026 - 8/28/2026 Shenzhen, China ISCST Symposium 2026 8/30/2026 - 9/2/2026 Minneapolis MN, United States SEMICON Taiwan 2026 9/2/2026 - 9/4/2026 Taipei, Taiwan CPEM 2026 9/6/2026 - 9/11/2026 Madrid, Spain More Events ...