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ICEP 2024 ICEP 2024 Closed International Conference on Electronic Packaging Dates: Wednesday, April 17, 2024 - Saturday, April 20, 2024 Venue: Toyama International Conference Center, Toyama, Japan ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. Website: https://www.jiep.or.jp/icep/ Related Products: more products... I-PULSE F2 8*2MM feeder F2-82M LG4-M2A00-510 feeder Leaderway Industrial Co.,Ltd Ceramic Snail Wire Guides(Ceramic pigtail coil)Textile Ceramic Guide Supplier Ch Hartai Technology Industry Co., Ltd. 3D Printed Electronics AJ 45X Neotech AMT GmbH QS-5188C Desk Lead Free Reflow Oven Shenzhen Qinsi Science & Technology Co.,Ltd Automated Optical Inspection Shenzhen ETA electronic equipment CO.,LTD Venues Toyama International Conference Center 1-2 Ote-machi Toyama-city Toyama 930-0084, Toyama Japan Tel: +81-76-424 5931 https://www.ticc.co.jp/ Organizers Japan Institute of Electronics packaging (JIEP) 3-12-2 Nishiogikita, Suginami-ku, Tokyo 167-0042, Tokyo Japan Tel: +81-03-5310-2010 https://www.jiep.or.jp/ Future Dates: ICEP 2025 4/15/2025 - 4/19/2025 Nagano, Japan Related Events: PCB East 2025 4/29/2025 - 5/2/2025 Boxborough MA, United States SMTconnect 2025 5/6/2025 - 5/8/2025 Nuremberg, Germany ARC Summit 2025 5/14/2025 - 5/15/2025 Chicago IL, United States FINETECH Osaka 2025 5/14/2025 - 5/16/2025 Osaka, Japan Electrontech China 2025 5/14/2025 - 5/16/2025 Wuhan, China More Events ...