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ICEP 2024 ICEP 2024 Closed International Conference on Electronic Packaging Dates: Wednesday, April 17, 2024 - Saturday, April 20, 2024 Venue: Toyama International Conference Center, Toyama, Japan ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. Website: https://www.jiep.or.jp/icep/ Venues Toyama International Conference Center 1-2 Ote-machi Toyama-city Toyama 930-0084, Toyama Japan Tel: +81-76-424 5931 https://www.ticc.co.jp/ Organizers Japan Institute of Electronics packaging (JIEP) 3-12-2 Nishiogikita, Suginami-ku, Tokyo 167-0042, Tokyo Japan Tel: +81-03-5310-2010 https://www.jiep.or.jp/ Future Dates: ICEP 2025 4/15/2025 - 4/19/2025 Nagano, Japan ICEP-HBS 2026 4/14/2026 - 4/18/2026 Hiroshima, Japan ICEP 2027 TBD, Japan Previous Dates: Related Events: CWIEME Shanghai 2026 6/24/2026 - 6/26/2026 Shanghai, China Philippines Electronics Manufacturing Expo 2026 7/1/2026 - 7/3/2026 Manila, Philippines ICMBE 2026 7/12/2026 - 7/16/2026 Detroit MI, United States IVNC 2026 7/13/2026 - 7/17/2026 Tokyo, Japan Electronics Manufacturing Expo Asia (EMAX) 2026 7/22/2026 - 7/24/2026 Penang, Malaysia More Events ...