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Device Packaging 2018 |
Closed
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| 14th International Conference on Device Packaging |
| Dates:
Tuesday, March 6, 2018 - Thursday, March 8, 2018
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| Venue: WekoPa Resort and Casino, Fountain Hills,
Phoenix AZ,
United States |
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The Annual Device Packaging Conference (DPC) is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
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Website: http://www.imaps.org/devicepackaging
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