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3D ASIP 2016
3D ASIP 2016

3D ASIP 2016

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13th Annual Conference on 3D Architectures for Semiconductor Integration and Packaging
Dates: Tuesday, December 13, 2016 - Thursday, December 15, 2016
Venue: Marriott San San Francisco Airport, San Francisco CA, United States
The 3D ASIP conference offers a unique marketing opportunity to our sponsors. Our extensive pre-conference marketing campaign and on-site activities provide excellent exposure for your company or organization and exposure to tens of thousands of qualified industry members. Share your message during the conference with a centralized audience of senior technologists, thought leaders, and business executives in the semiconductor integration and packaging industry.

Website: http://3dasip.org/
Organizers
IMAPS - International Microelectronics Assembly and Packaging Society
100 Park Drive, Suite 102 (Office) Research Triangle Park, NC 27709-5127, Durham
United States
Tel: +1-919-293-5000
http://www.imaps.org/
Future Dates:
3D ASIP 201712/5/2017 - 12/7/2017 San Francisco CA, United States
Previous Dates:
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