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System in Package 2017
System in Package 2017

System in Package 2017

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Inaugural Conference and Exhibition on System in Package (SiP) Technology
Dates: Tuesday, June 27, 2017 - Thursday, June 29, 2017
Venue: Doubletree Sonoma Wine Country, San Francisco CA, United States
SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs - market trends, system integration/miniaturization, and new technology innovation enablers to meet current and future SiP challenges. This conference will bring the entire SiP supply and design chain from OEM, Fabless, IDM, OSAT, EMS, EDA, silicon foundries, equipment and material suppliers together under one roof.

Website: http://www.imaps.org/sip/
Organizers
IMAPS - International Microelectronics Assembly and Packaging Society
100 Park Drive, Suite 102 (Office) Research Triangle Park, NC 27709-5127, Durham
United States
Tel: +1-919-293-5000
http://www.imaps.org/
Future Dates:
Advanced System in Package 20196/25/2019 - 6/27/2019 Monterey CA, United States
IMAPS Advanced System-in-Package 20226/21/2022 - 6/23/2022 Santa Rosa CA, United States
Previous Dates:
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