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3D ASIP 2017 3D ASIP 2017 Closed 14th Annual Conference on 3D Architectures for Semiconductor Integration and Packaging Dates: Tuesday, December 5, 2017 - Thursday, December 7, 2017 Venue: Marriott San San Francisco Airport, San Francisco CA, United States The 3D ASIP conference offers a unique marketing opportunity to our sponsors. Our extensive pre-conference marketing campaign and on-site activities provide excellent exposure for your company or organization and exposure to tens of thousands of qualified industry members. Share your message during the conference with a centralized audience of senior technologists, thought leaders, and business executives in the semiconductor integration and packaging industry. Website: http://3dasip.org/ Related Products: more products... M2M Controllers StarChip SAS eMMC NAND Flash Test Socket Shenzhen KLD Technology Co,.Ltd. STM8 8-bit MCUs STMicroelectronics BS82C16A-3/BS82D20A-3 -- Touch Key 8-Bit Flash MCU with LED/LCD Driver Holtek Semiconductor Inc. Aerosol Jet Lab systems Optomec Corporate Organizers IMAPS - International Microelectronics Assembly and Packaging Society 100 Park Drive, Suite 102 (Office) Research Triangle Park, NC 27709-5127, Durham United States Tel: +1-919-293-5000 http://www.imaps.org/ Future Dates: Previous Dates: 3D ASIP 2016 12/13/2016 - 12/15/2016 San Francisco CA, United States Related Events: IEEE ICECS 2026 11/8/2026 - 11/11/2026 Thessaloniki, Greece Electronica 2026 11/10/2026 - 11/13/2026 Munich, Germany IIC Shenzhen 2026 12/2/2026 - 12/3/2026 Shenzhen, China IEEE ISICAS 2026 12/4/2026 - 12/6/2026 Turin, Italy IEEE ICM 2026 12/7/2026 - 12/10/2026 Kuching, Malaysia More Events ...