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CHIPcon 2023 |
Closed
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| Inaugural Conference and Exhibition on System in Package (SiP) Technology |
| Dates:
Monday, July 24, 2023 - Thursday, July 27, 2023
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| Venue: DoubleTree by Hilton San Jose,
San Jose CA,
United States |
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The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies, and business trends.
IMAPS has rebranded its well-attended, annual Advanced System-in-Package conference to the Chiplet & Heterogeneous Integration Packaging Conference CHIPcon. As the world's leading semiconductor companies continue to push the edge of process technology, the industry is seeing a marked shift in device design and architectures to overcome economic and time-to-market challenges. The conference name change is the result of the rapidly rising adoption of chiplet based device architectures, and the increasingly critical role packaging technology is taking in the manufacture and enablement of these advanced products.
The IMAPS CHIPcon conference will focus exclusively on innovative device integration technology developments, solutions, and business trends. CHIPcon 2023 will offer cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, high-performance computing and networking market segments.
Advanced CHIP technology is an umbrella term to cover a variety of packaging technology subsets, including laminate/glass/ ceramic/silicon/leadframe based SiP, FanOut RDL, 2.5D/3D Heterogeneous Integration, and modules.
The conference will explore the current state of the art and emerging packaging technology roadmap supporting the integration and delivery of a complete system or subsystem solution.'Attendees will be exposed to thought-provoking advanced package structures with high functioning system performance, mechanical reliability, thermal management and high yield manufacturability.
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Website: https://imaps.org/page/CHIPcon2023
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