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ICEP-HBS 2026 |
159 days left
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| International Conference on Electronic Packaging & Hybrid Bonding Symposium |
| Dates:
Tuesday, April 14, 2026 - Saturday, April 18, 2026
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| Venue: International Conference Center Hiroshima,
Hiroshima,
Japan |
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ICEP is the largest international conference on electronic packaging in Japan, attracting more than 900 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE EPS, IEEEEPS Japan Chapter, iMAPS, and SMTA. The conference has technical sessions covering a wide range of'topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, and thermal management. Since its inauguration in'2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.
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Website: https://www.jiep.or.jp/icep/
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| Previous Dates: | | | ICEP 2025 | 4/15/2025 - 4/19/2025 | Nagano, Japan | | ICEP 2024 | 4/17/2024 - 4/20/2024 | Toyama, Japan | |
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