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3DIC 2027
3DIC 2027

3DIC 2027

IEEE International 3D Systems Integration Conference (3DIC)
Dates: TBD
Venue: TBD, TBD, TBD
The IEEE 3DIC Conference will cover all 3D system integration topics, including 3D/Chiplet process technology, materials, equipment, circuits technology, design methodology, and applications.

Website: https://3dic-conf.org/
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Organizers
IEEE Electronics Packaging Society
Piscataway, Piscataway
United States
Tel: +1-732-null
https://eps.ieee.org/
Future Dates:
Previous Dates:
3DIC 20269/29/2026 - 10/2/2026 Atlanta GA, United States
3DIC 20249/25/2024 - 9/27/2024 Sendai, Japan
3DIC 20235/10/2023 - 5/12/2023 Cork, Ireland
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