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IMAPS Device Packaging 2026 |
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IMAPS Device Packaging 2026 |
309 days left
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22nd International Conference on Device Packaging |
Dates:
Monday, March 2, 2026 - Thursday, March 5, 2026
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Venue: Sheraton Grand at Wild Horse Pass,
Phoenix AZ,
United States |
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The Annual Device Packaging Conference (DPC) is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
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Website: https://imaps.org/page/Device-Packaging
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