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CICMT 2024
CICMT 2024

CICMT 2024

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IMAPS/ACerS 19th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
Dates: Wednesday, April 10, 2024 - Friday, April 12, 2024
Venue: Osaka University Nakanoshima Center, Osaka, Japan
Held in conjunction with the JWRI/SPS (Joining and Welding Research Institute/Smart Processing Society, Japan) 3rd Global Forum on Smart Additive Manufacturing, Design & Evaluation (Smart-MADE 2024)

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in the technical program. The Ceramic Interconnect focuses on cost effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems focus is on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities.

Smart Additive Manufacturing, Design & Evaluation (Smart MADE) is recognized as a global discussion forum on Additive manufacturing and 3D printing technologies. These technologies are novel fabrication processes for advanced materials and components with multifunctional structures. In this approach, three-dimensional models are designed and created according to theoretical concepts using computer software, and two-dimensional cross sections are created by automatic slicing operations. In particular, computer aided design, manufacture and evaluation can be considered as smart additive processing. Various functional metal or ceramic components of dielectric or magnetic lattices to control electromagnetic fields, electrodes, or catalysts with large surface areas, and bio-materials components for medical applications, could also be developed. Large scale structural components for aerospace and other high temperature applications can be fabricated, without casting molds, with internal cooling path networks. This workshop focuses on superiority of design, efficient processing, and clear communication of results in the additive manufacturing and 3D printing processes.

Website: https://imaps.org/page/CICMT2024
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Organizers
IMAPS - International Microelectronics Assembly and Packaging Society
100 Park Drive, Suite 102 (Office) Research Triangle Park, NC 27709-5127, Durham
United States
Tel: +1-919-293-5000
http://www.imaps.org/
Future Dates:
CICMT 2025 TBD, Japan
Previous Dates:
CICMT 20234/18/2023 - 4/20/2023 Albuquerque NM, United States
CICMT 20227/13/2022 - 7/15/2022 Vienna, Austria
CICMT 20194/16/2019 - 4/19/2019 Shanghai, China
CICMT 20184/18/2018 - 4/20/2018 Aveiro, Portugal
CICMT 20174/19/2017 - 4/21/2017 Nara, Japan
CICMT 20164/19/2016 - 4/21/2016 Denver CO, United States
CICMT 20154/20/2015 - 4/23/2015 Dresden, Germany
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