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Device Packaging 2024 |
Closed
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| 20th International Conference on Device Packaging |
| Dates:
Monday, March 18, 2024 - Thursday, March 21, 2024
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| Venue: WekoPa Resort and Casino, Fountain Hills,
Phoenix AZ,
United States |
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The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
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Website: https://imaps.org/page/Device-Packaging
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