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| IMAPS Device Packaging 2027 |
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IMAPS Device Packaging 2027 |
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| 23rd International Conference on Device Packaging |
| Dates:
TBD
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| Venue: Phoenix AZ,
Phoenix AZ,
United States |
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The Annual Device Packaging Conference (DPC) is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
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Website: https://imaps.org/page/Device-Packaging
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