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CICMT 2026
CICMT 2026

CICMT 2026

IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
Dates: TBD
Venue: TBD, TBD, TBD
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in the technical program. The Ceramic Interconnect focuses on cost effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems focus is on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities.

Website: https://imaps.org/
Related Products: more products...
Organizers
IMAPS - International Microelectronics Assembly and Packaging Society
100 Park Drive, Suite 102 (Office) Research Triangle Park, NC 27709-5127, Durham
United States
Tel: +1-919-293-5000
http://www.imaps.org/
Previous Dates:
CICMT 20244/10/2024 - 4/12/2024 Osaka, Japan
CICMT 20234/18/2023 - 4/20/2023 Albuquerque NM, United States
CICMT 20227/13/2022 - 7/15/2022 Vienna, Austria
CICMT 20194/16/2019 - 4/19/2019 Shanghai, China
CICMT 20184/18/2018 - 4/20/2018 Aveiro, Portugal
CICMT 20174/19/2017 - 4/21/2017 Nara, Japan
CICMT 20164/19/2016 - 4/21/2016 Denver CO, United States
CICMT 20154/20/2015 - 4/23/2015 Dresden, Germany
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