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ICEP 2024 ICEP 2024 Closed International Conference on Electronic Packaging Dates: Wednesday, April 17, 2024 - Saturday, April 20, 2024 Venue: Toyama International Conference Center, Toyama, Japan ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. Website: https://www.jiep.or.jp/icep/ Related Products: more products... I-PULSE F2 8*2MM feeder F2-82M LG4-M2A00-510 feeder Leaderway Industrial Co.,Ltd Ceramic Snail Wire Guides(Ceramic pigtail coil)Textile Ceramic Guide Supplier Ch Hartai Technology Industry Co., Ltd. 3D Printed Electronics AJ 45X Neotech AMT GmbH QS-5188C Desk Lead Free Reflow Oven Shenzhen Qinsi Science & Technology Co.,Ltd Automated Optical Inspection Shenzhen ETA electronic equipment CO.,LTD Venues Toyama International Conference Center 1-2 Ote-machi Toyama-city Toyama 930-0084, Toyama Japan Tel: +81-76-424 5931 https://www.ticc.co.jp/ Organizers Japan Institute of Electronics packaging (JIEP) 3-12-2 Nishiogikita, Suginami-ku, Tokyo 167-0042, Tokyo Japan Tel: +81-03-5310-2010 https://www.jiep.or.jp/ Related Events: IMAPS Power Electronics 2024 5/8/2024 - 5/9/2024 Boston MA, United States FINETECH Osaka 2024 5/8/2024 - 5/10/2024 Osaka, Japan Electrontech China 2024 5/9/2024 - 5/11/2024 Wuhan, China CPCA SHOW Shanghai 2024 5/13/2024 - 5/15/2024 Shanghai, China CWIEME Berlin 2024 5/14/2024 - 5/16/2024 Berlin, Germany More Events ...