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IMAPS Device Packaging 2026
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116 days left
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22nd International Conference on Device Packaging
3/2/2026 - 3/5/2026
Venue: Sheraton Grand at Wild Horse Pass, Phoenix AZ, United States
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The Annual Device Packaging Conference (DPC) is an international event organized by the International Microelectronics Assembly and Packaging Society ... |
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CICMT 2026
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IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
Dates: TBD
Venue: TBD, TBD, TBD
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The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences an... |
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MiNaPAD 2026
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216 days left
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Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum
6/10/2026 - 6/11/2026
Venue: WTC Congress Center, Grenoble, France
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MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest sha... |
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NordPac 2026
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IMAPS Nordic Conference on Microelectronics Packaging
Dates: TBD
Venue: TBD, TBD, TBD
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The event brings together both academics, as well as industry leaders, to discuss and debate state-of-the-art and future trends in microelectronics, p... |
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IMAPS HiTEN 2026
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International Conference and Exhibition on High Temperature Electronics Network
Dates: TBD
Venue: TBD, TBD, United Kingdom
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The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all o... |
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ESTC 2026
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Electronics System-Integration Technology Conference
Dates: TBD
Venue: TBD, TBD, TBD
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Organized by IEEE-EPS (former CPMT) since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for acade... |
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IMAPS Symposium 2026
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326 days left
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59th International Symposium on Microelectronics
9/28/2026 - 10/1/2026
Venue: Encore Boston Harbor Hotel, Boston MA, United States
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The International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The I... |
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IMAPS German Autumn Conference 2026
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International Microelectronics Assembly and Packaging Society Deutschland Conference
Dates: TBD
Venue: Munich, Munich, Germany
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Every autumn, IMAPS Germany e.V. organizes its annual conference on current topics in the field of assembly and connection technology in all fields of... |
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IMAPS Device Packaging 2027
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23rd International Conference on Device Packaging
Dates: TBD
Venue: Phoenix AZ, Phoenix AZ, United States
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The Annual Device Packaging Conference (DPC) is an international event organized by the International Microelectronics Assembly and Packaging Society ... |
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CHIPcon 2027
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The Leading Event for Chiplet and Heterogeneous Integration Packaging (CHIP) Technology
Dates: TBD
Venue: TBD, TBD, United States
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CHIPcon is a conference focused on the opportunities for the expanded adoption of chiplet-based devices in not only data center applications, but also... |
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IMAPS Europe EMPC 2027
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677 days left
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26th European Microelectronics and Packaging Conference (EMPC) & Exhibition
9/14/2027 - 9/16/2027
Venue: Ingolstadt, Ingolstadt, Germany
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The European Microelectronics and Packaging Conference (EMPC 2027) will take place in Ingolstadt from September 14th to 16th, 2027. In addition, short... |
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IMAPS Symposium 2027
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60th International Symposium on Microelectronics
Dates: TBD
Venue: TBD, TBD, United States
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The International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The I... |
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MiNaPAD 2028
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Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum
Dates: TBD
Venue: WTC Congress Center, Grenoble, France
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MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest sha... |
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IMAPS Europe EMPC 2029
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27th European Microelectronics and Packaging Conference (EMPC) & Exhibition
Dates: TBD
Venue: TBD, TBD, TBD
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EMPC will present the best of microelectronics packaging and interconnection technologies, providing world-class coverage of technological innovation ... |
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