IMAPS Nordic Conference on Microelectronics Packaging
6/11/2024 - 6/13/2024
Venue: Scandic Rosendahl, Tampere, Finland
IMAPS Nordic would like to welcome you to the IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac 2024, in Tampere, Finland. Th...
Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum
6/19/2024 - 6/20/2024
Venue: WTC Congress Center, Grenoble, France
MiNaPAD is a 2-days conference. The objective of this event is to reinforce the design community (which constitutes the largest share of the semicondu...
The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system in...
International Microelectronics Assembly and Packaging Society Deutschland Conference
Dates: TBD
Venue: Hochschule Munchen, Munich, Germany
Every autumn, IMAPS Germany e.V. organizes its annual conference on current topics in the field of assembly and connection technology in all fields of...
The event brings together both academics, as well as industry leaders, to discuss and debate state-of-the-art and future trends in microelectronics, p...
Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum
Dates: TBD
Venue: WTC Congress Center, Grenoble, France
MiNaPAD is a 2-days conference. The objective of this event is to reinforce the design community (which constitutes the largest share of the semicondu...
Organized by IEEE-EPS (former CPMT) since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for acade...
