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IEEE EDAPS 2025
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-116 days
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IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium
12/15/2025 - 12/17/2025
Venue: Hokkaido University, Sapporo, Japan
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The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served a... |
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EPTC 2025
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-129 days
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27th Electronics Packaging Technology Conference
12/2/2025 - 12/5/2025
Venue: Resorts World Sentosa, Singapore, Singapore
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The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co... |
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ICEPT 2025
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-248 days
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26th International Conference on Electronic Packaging Technology (ICEPT)
8/5/2025 - 8/7/2025
Venue: Sheraton Shanghai Jiading, Shanghai, China
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The International Conference on Electronic Packaging Technology (ICEPT) is the largest and most cohesive packaging technology conference in Asia, whic... |
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IEEE ECTC 2025
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-318 days
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IEEE 75th Electronic Components and Technologies Conference (ECTC)
5/27/2025 - 5/30/2025
Venue: Gaylord Texan Resort & Convention Center, Grapevine TX, United States
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The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components a... |
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IEEE EDAPS 2024
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-479 days
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IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium
12/17/2024 - 12/19/2024
Venue: Taj Yeshwantpur, Bengaluru, India
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The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served a... |
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IEEE EPTC 2024
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-493 days
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IEEE 26th Electronics Packaging Technology Conference (EPTC)
12/3/2024 - 12/6/2024
Venue: Grand Copthorne Waterfront Hotel Singapore, Singapore, Singapore
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The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co... |
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3DIC 2024
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-562 days
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13th IEEE International 3D Systems Integration Conference (3DIC)
9/25/2024 - 9/27/2024
Venue: Hotel Metropolitan Sendai, Sendai, Japan
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The IEEE International 3D Systems Integration Conference (3DIC) will be held at the Hotel Metropolitan Sendai and Sendai Kokusai Hotel in Sendai, Japa... |
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ESTC 2024
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-576 days
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10th Electronics System-Integration Technology Conference
9/11/2024 - 9/13/2024
Venue: MOA Berlin Hotel, Berlin, Germany
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The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system in... |
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ICEPT 2024
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-611 days
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25th International Conference on Electronic Packaging Technology (ICEPT)
8/7/2024 - 8/9/2024
Venue: Tiangong University, Tianjin, China
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The International Conference on Electronic Packaging Technology (ICEPT) has been recognized as one of the top four electronic packaging academic confe... |
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IEEE ECTC 2024
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-682 days
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IEEE 74th Electronic Components and Technologies Conference (ECTC)
5/28/2024 - 5/31/2024
Venue: Gaylord Rockies Resort & Convention Center, Denver CO, United States
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The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components a... |
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IEEE EDAPS 2023
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-850 days
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IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium
12/12/2023 - 12/14/2023
Venue: Sugar Beach Resort, Flic en Flac, Mauritius
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The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served a... |
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IEEE EPTC 2023
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-857 days
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IEEE 25th Electronics Packaging Technology Conference (EPTC)
12/5/2023 - 12/8/2023
Venue: Grand Copthorne Waterfront Hotel, Singapore, Singapore
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The 25th IEEE Electronics Packaging Technology Conference (EPTC2023) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and... |
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ICEPT 2023
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-976 days
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24th International Conference on Electronic Packaging Technology (ICEPT)
8/8/2023 - 8/11/2023
Venue: Shihezi university, Shihezi City, China
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The International Conference on Electronic Packaging Technology (ICEPT) has been recognized as one of the top four electronic packaging academic confe... |
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IEEE ECTC 2023
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-1046 days
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IEEE 73rd Electronic Components and Technologies Conference (ECTC)
5/30/2023 - 6/2/2023
Venue: JW Marriott Orlando, Orlando FL, United States
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The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components a... |
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3DIC 2023
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-1066 days
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IEEE International 3D System Integration Conference
5/10/2023 - 5/12/2023
Venue: Tyndall National Institute, Cork, Ireland
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So much has changed since the first 3DIC conference in 2010! 3D integrated circuits have moved from academic curiosity to solid commercial reality. ... |
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ESTC 2022
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-1305 days
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Orgill Dealer Markets
9/13/2022 - 9/16/2022
Venue: Ramada Hotel, Sibiu, Romania
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Organized by IEEE-EPS (former CPMT) since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for acade... |
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ESTC 2018
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-2761 days
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Electronics System-Integration Technology Conference
9/18/2018 - 9/21/2018
Venue: Westin Bellevue Dresden Hotel, Dresden, Germany
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Organized by IEEE-CPMT since 2006 Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry ... |
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IEEE ECTC 2017
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-3237 days
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IEEE 67th Electronic Components and Technology Conference (ECTC)
5/30/2017 - 6/2/2017
Venue: Walt Disney World Swan and Dolphin Resort, Orlando FL, United States
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The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components a... |
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ESTC 2016
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-3496 days
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6th Electronics System-Integration Technology Conference
9/13/2016 - 9/16/2016
Venue: World Trade Center, Grenoble, France
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Organized by IEEE-CPMT since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and indu... |
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