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Japan Institute of Electronics packaging (JIEP)
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ICEP-HBS 2026 -23 days
International Conference on Electronic Packaging & Hybrid Bonding Symposium
4/14/2026 - 4/18/2026
Venue: International Conference Center Hiroshima, Hiroshima, Japan
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 900 attendees and hosting about 35 technical sessi...
ICEP 2025 -387 days
International Conference on Electronic Packaging
4/15/2025 - 4/19/2025
Venue: Wakasato Municipal Cultural Hall, Nagano, Japan
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessi...
ICEP 2024 -750 days
International Conference on Electronic Packaging
4/17/2024 - 4/20/2024
Venue: Toyama International Conference Center, Toyama, Japan
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessi...

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