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IMAPS - International Microelectronics Assembly and Packaging Society
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HiTEN 2017 -3403 days
International Conference and Exhibition on High Temperature Electronics Network
7/10/2017 - 7/12/2017
Venue: Queens' College, Cambridge, United Kingdom
The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all o...
System in Package 2017 -3416 days
Inaugural Conference and Exhibition on System in Package (SiP) Technology
6/27/2017 - 6/29/2017
Venue: Doubletree Sonoma Wine Country, San Francisco CA, United States
SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs - market trends, system integration/m...
RaMP 2017 -3478 days
RF and Microwave Technical Conference
4/26/2017 - 4/27/2017
Venue: Espace Saint-Martin, Paris, France
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, acade...
CICMT 2017 -3485 days
IMAPS/ACerS 13th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
4/19/2017 - 4/21/2017
Venue: Todai-ji Museum, Nara, Japan
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences an...
3D ASIP 2016 -3612 days
13th Annual Conference on 3D Architectures for Semiconductor Integration and Packaging
12/13/2016 - 12/15/2016
Venue: Marriott San San Francisco Airport, San Francisco CA, United States
The 3D ASIP conference offers a unique marketing opportunity to our sponsors. Our extensive pre-conference marketing campaign and on-site activities p...
IMAPS 2016 -3676 days
49th International Symposium on Microelectronics
10/10/2016 - 10/13/2016
Venue: Pasadena Convention Center, Los Angeles CA, United States
The 49th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). ...
HiTEC 2016 -3829 days
International Conference on High Temperature Electronics
5/10/2016 - 5/12/2016
Venue: Albuquerque Marriott Pyramid North, Albuquerque NM, United States
HiTEC 2016 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the hig...
Symposium on Polymers 2016 -3844 days
17th Symposium on Polymers for Microelectronics
4/25/2016 - 4/27/2016
Venue: Winterthur Museum, Wilmington DE, United States
The International Microelectronics Assembly and Packaging Society (IMAPS) is organizing the 17th Symposium on Polymers for Microelectronics. The theme...
CICMT 2016 -3850 days
IMAPS/ACerS 12th International Conference and Exhibition on Ceramic Interconnect and'Ceramic Microsystems Technologies
4/19/2016 - 4/21/2016
Venue: Sheraton Denver Downtown Hotel, Denver CO, United States
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences an...
RaMP 2016 -3864 days
RF and Microwave Technical Conference
4/5/2016 - 4/6/2016
Venue: DoubleTree San Diego - Hotel Circle, San Diego CA, United States
The objective of the RF and Microwave Technical Conference is to provide a unique forum that brings together scientists, engineers, manufacturing, aca...
Packaging For Healthcare IoT 2016 -3934 days
Advanced Technology Workshop & Tabletop Exhibition on Packaging For Healthcare IoT
1/26/2016 - 1/27/2016
Venue: San Diego Marriott Mission Valley, San Diego CA, United States
Packaging For Healthcare IoT 2016 will bring together technologists in semiconductor packaging with life science experts interested in applying the In...
IMAPS 2015 -4026 days
48th International Symposium on Microelectronics
10/26/2015 - 10/29/2015
Venue: Rosen Centre Hotel, Orlando FL, United States
The 48th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). ...
CICMT 2015 -4215 days
International Conference & Exhibition on Ceramic Interconnect & Ceramic Microsystems Technologies CICMT
4/20/2015 - 4/23/2015
Venue: Fraunhofer Institute Center, Dresden, Germany
The CICMT has been established for more than a decade as a global high-level platform for the presentation and discussion of the latest research and d...
Device Packaging 2015 -4250 days
11th International Conference on Device Packaging
3/16/2015 - 3/19/2015
Venue: Radisson Fort McDowell Resort and Casino, Phoenix AZ, United States
The 11th Annual Device Packaging Conference (DPC 2015) will be held in Fountain Hills, Arizona, on March 16-19, 2015. It is an international event org...

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