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IMAPS 2019
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-2040 days
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52nd International Symposium on Microelectronics
10/1/2019 - 10/3/2019
Venue: Hynes Convention Center, Boston MA, United States
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The 52nd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). ... |
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EMPC 2019
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-2055 days
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22nd European Microelectronics and Packaging Conference (EMPC) & Exhibition
9/16/2019 - 9/19/2019
Venue: Conference Center PISA, Pisa, Italy
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The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wan... |
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HiTEN 2019
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-2125 days
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International Conference and Exhibition on High Temperature Electronics Network
7/8/2019 - 7/10/2019
Venue: University of Oxford, Oxford, United Kingdom
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The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all o... |
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Advanced System in Package 2019
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-2138 days
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Inaugural Conference and Exhibition on System in Package (SiP) Technology
6/25/2019 - 6/27/2019
Venue: Monterey Marriott, Monterey CA, United States
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SiP 2019 is a continuation of IMAPS SiP Conference which first started in June 2017 as the first System-in-Package (SiP) conference fully dedicated to... |
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CICMT 2019
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-2208 days
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IMAPS/ACerS 15th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
4/16/2019 - 4/19/2019
Venue: New World Shanghai Hotel, Shanghai, China
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The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences an... |
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IMAPS 2018
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-2398 days
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51st International Symposium on Microelectronics
10/8/2018 - 10/11/2018
Venue: Pasadena Convention Center, Los Angeles CA, United States
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The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). ... |
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CICMT 2018
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-2571 days
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IMAPS/ACerS 14th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
4/18/2018 - 4/20/2018
Venue: University of Aveiro, Aveiro, Portugal
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The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences an... |
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Device Packaging 2018
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-2614 days
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14th International Conference on Device Packaging
3/6/2018 - 3/8/2018
Venue: WekoPa Resort and Casino, Fountain Hills, Phoenix AZ, United States
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The Annual Device Packaging Conference (DPC) is an international event organized by the International Microelectronics Assembly and Packaging Society ... |
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3D ASIP 2017
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-2705 days
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14th Annual Conference on 3D Architectures for Semiconductor Integration and Packaging
12/5/2017 - 12/7/2017
Venue: Marriott San San Francisco Airport, San Francisco CA, United States
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The 3D ASIP conference offers a unique marketing opportunity to our sponsors. Our extensive pre-conference marketing campaign and on-site activities p... |
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IMAPS 2017
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-2762 days
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50th International Symposium on Microelectronics
10/9/2017 - 10/12/2017
Venue: Raleigh Convention Center, Raleigh NC, United States
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The 50th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). ... |
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EMPC 2017
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-2791 days
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21st Euro-pean Microelectronics and Packaging Conference (EMPC) & Exhibition
9/10/2017 - 9/13/2017
Venue: Warsaw University of Technology, Warsaw, Poland
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At the EMPC, we will provide you with excellent presentations (and posters) of most recent research and development results worldwide. Bringing togeth... |
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HiTEN 2017
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-2853 days
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International Conference and Exhibition on High Temperature Electronics Network
7/10/2017 - 7/12/2017
Venue: Queens' College, Cambridge, United Kingdom
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The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all o... |
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System in Package 2017
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-2866 days
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Inaugural Conference and Exhibition on System in Package (SiP) Technology
6/27/2017 - 6/29/2017
Venue: Doubletree Sonoma Wine Country, San Francisco CA, United States
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SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs - market trends, system integration/m... |
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RaMP 2017
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-2928 days
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RF and Microwave Technical Conference
4/26/2017 - 4/27/2017
Venue: Espace Saint-Martin, Paris, France
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The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, acade... |
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CICMT 2017
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-2935 days
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IMAPS/ACerS 13th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
4/19/2017 - 4/21/2017
Venue: Todai-ji Museum, Nara, Japan
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The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences an... |
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3D ASIP 2016
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-3062 days
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13th Annual Conference on 3D Architectures for Semiconductor Integration and Packaging
12/13/2016 - 12/15/2016
Venue: Marriott San San Francisco Airport, San Francisco CA, United States
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The 3D ASIP conference offers a unique marketing opportunity to our sponsors. Our extensive pre-conference marketing campaign and on-site activities p... |
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IMAPS 2016
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-3126 days
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49th International Symposium on Microelectronics
10/10/2016 - 10/13/2016
Venue: Pasadena Convention Center, Los Angeles CA, United States
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The 49th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). ... |
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HiTEC 2016
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-3279 days
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International Conference on High Temperature Electronics
5/10/2016 - 5/12/2016
Venue: Albuquerque Marriott Pyramid North, Albuquerque NM, United States
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HiTEC 2016 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the hig... |
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Symposium on Polymers 2016
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-3294 days
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17th Symposium on Polymers for Microelectronics
4/25/2016 - 4/27/2016
Venue: Winterthur Museum, Wilmington DE, United States
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The International Microelectronics Assembly and Packaging Society (IMAPS) is organizing the 17th Symposium on Polymers for Microelectronics. The theme... |
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CICMT 2016
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-3300 days
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IMAPS/ACerS 12th International Conference and Exhibition on Ceramic Interconnect and'Ceramic Microsystems Technologies
4/19/2016 - 4/21/2016
Venue: Sheraton Denver Downtown Hotel, Denver CO, United States
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The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences an... |
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