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IMAPS - International Microelectronics Assembly and Packaging Society
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IMAPS Symposium 2022 -1446 days
55th International Symposium on Microelectronics
10/3/2022 - 10/6/2022
Venue: Hynes Convention Center, Boston MA, United States
The 55th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) a...
HiTEN 2022 -1523 days
International Conference and Exhibition on High Temperature Electronics Network
7/18/2022 - 7/20/2022
Venue: University of Oxford, Oxford, United Kingdom
The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all o...
CICMT 2022 -1528 days
International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
7/13/2022 - 7/15/2022
Venue: Austrian Economic Chambers, Vienna, Austria
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences an...
IMAPS Advanced System-in-Package 2022 -1550 days
Inaugural Conference and Exhibition on System in Package (SiP) Technology
6/21/2022 - 6/23/2022
Venue: DoubleTree by Hilton Sonoma - Wine Country, Santa Rosa CA, United States
IMAPS established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business tre...
Medical Microelectronics 2022 -1633 days
7th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
3/30/2022 - 3/31/2022
Venue: Town and Country Hotel, San Diego CA, United States
The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging ...
IMAPS 2021 -1803 days
54th International Symposium on Microelectronics
10/11/2021 - 10/14/2021
Venue: Town and Country Resort, San Diego CA, United States
The 54th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). ...
Device Packaging 2020 -2391 days
16th International Conference on Device Packaging
3/2/2020 - 3/5/2020
Venue: WekoPa Resort and Casino, Fountain Hills, Phoenix AZ, United States
The Annual Device Packaging Conference (DPC) is an international event organized by the International Microelectronics Assembly and Packaging Society ...
IMAPS 2019 -2544 days
52nd International Symposium on Microelectronics
10/1/2019 - 10/3/2019
Venue: Hynes Convention Center, Boston MA, United States
The 52nd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). ...
EMPC 2019 -2559 days
22nd European Microelectronics and Packaging Conference (EMPC) & Exhibition
9/16/2019 - 9/19/2019
Venue: Conference Center PISA, Pisa, Italy
The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wan...
HiTEN 2019 -2629 days
International Conference and Exhibition on High Temperature Electronics Network
7/8/2019 - 7/10/2019
Venue: University of Oxford, Oxford, United Kingdom
The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all o...
Advanced System in Package 2019 -2642 days
Inaugural Conference and Exhibition on System in Package (SiP) Technology
6/25/2019 - 6/27/2019
Venue: Monterey Marriott, Monterey CA, United States
SiP 2019 is a continuation of IMAPS SiP Conference which first started in June 2017 as the first System-in-Package (SiP) conference fully dedicated to...
CICMT 2019 -2712 days
IMAPS/ACerS 15th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
4/16/2019 - 4/19/2019
Venue: New World Shanghai Hotel, Shanghai, China
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences an...
IMAPS 2018 -2902 days
51st International Symposium on Microelectronics
10/8/2018 - 10/11/2018
Venue: Pasadena Convention Center, Los Angeles CA, United States
The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). ...
CICMT 2018 -3075 days
IMAPS/ACerS 14th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
4/18/2018 - 4/20/2018
Venue: University of Aveiro, Aveiro, Portugal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences an...
Device Packaging 2018 -3118 days
14th International Conference on Device Packaging
3/6/2018 - 3/8/2018
Venue: WekoPa Resort and Casino, Fountain Hills, Phoenix AZ, United States
The Annual Device Packaging Conference (DPC) is an international event organized by the International Microelectronics Assembly and Packaging Society ...
3D ASIP 2017 -3209 days
14th Annual Conference on 3D Architectures for Semiconductor Integration and Packaging
12/5/2017 - 12/7/2017
Venue: Marriott San San Francisco Airport, San Francisco CA, United States
The 3D ASIP conference offers a unique marketing opportunity to our sponsors. Our extensive pre-conference marketing campaign and on-site activities p...
IMAPS 2017 -3266 days
50th International Symposium on Microelectronics
10/9/2017 - 10/12/2017
Venue: Raleigh Convention Center, Raleigh NC, United States
The 50th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). ...
EMPC 2017 -3295 days
21st Euro-pean Microelectronics and Packaging Conference (EMPC) & Exhibition
9/10/2017 - 9/13/2017
Venue: Warsaw University of Technology, Warsaw, Poland
At the EMPC, we will provide you with excellent presentations (and posters) of most recent research and development results worldwide. Bringing togeth...
HiTEN 2017 -3357 days
International Conference and Exhibition on High Temperature Electronics Network
7/10/2017 - 7/12/2017
Venue: Queens' College, Cambridge, United Kingdom
The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all o...
System in Package 2017 -3370 days
Inaugural Conference and Exhibition on System in Package (SiP) Technology
6/27/2017 - 6/29/2017
Venue: Doubletree Sonoma Wine Country, San Francisco CA, United States
SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs - market trends, system integration/m...

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